High Hardness Epoxy Potting Compound Shock Resistant Tight Sealing For Industrial Vibration Equipment PCB Encapsulation
Description of Epoxy Potting Compound
Epoxy potting compound is a high-performance adhesive extensively applied in electronic components, precision instruments, electric motors and other industries. Featuring outstanding adhesion, superior electrical insulation and remarkable corrosion resistance, it delivers reliable protection for encapsulated assemblies, improving structural stability and extending service lifespan.
technical parameter of epoxy potting compound:
| mixing ratio |
A: B =5:1 (weight ratio) |
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85-95 |
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distortion temperature ℃
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130-150 |
| low temperature resistant ℃ |
-30 |
Product Features of epoxy potting compound:
This product is an environmentally friendly, flame-retardant two-part (AB) epoxy potting resin. It features low viscosity and favorable flowability, allowing it to penetrate gaps inside assemblies easily while delivering superior thermal dissipation.
It cures at ambient or moderate temperatures with a balanced curing rate. Once fully cured, the material forms a bubble-free, smooth and glossy surface with high hardness.
The cured resin offers reliable acid and alkali resistance, outstanding protection against moisture, water and dust, together with resistance to thermal and weathering aging. It also exhibits excellent electrical insulation, compressive strength and high adhesive strength.
Application of epoxy resin potting:
Widely applied for insulation filling and moisture-proof sealing of electronic components, including electronic transformers, anion generators, module power supplies, high-voltage packs, aquarium pumps, relays, capacitors, ignition coils, AC/DC modules, LEDs, LED modules, vertical, horizontal, box and film-type AC capacitors, lighting fixtures and general electrical appliances.
How to use epoxy potting compound:
● Ensure components for potting are clean and dry.
● Check Part A for sediment; stir thoroughly if precipitates appear.
● Weigh Part A and Part B accurately by weight ratio (not volume). Mix fully to avoid incomplete curing.
● Start potting right after mixing and consume the mixture within pot life.
● The resin flows into gaps after pouring; re-pour if necessary.
● Keep the environment clean during curing to avoid dust contamination on uncured resin.
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High Hardness Epoxy Potting Compound Shock Resistant Tight Sealing For Industrial Vibration Equipment PCB Encapsulation Images
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